Micron Technology DRAM SDRAM-DDR3L, Part #: MT40A4G4JC-062E:E TR | Dynamic random access memory | DEX capacitor MT40A256M16LY-062E:F TR

MT40A256M16LY-062E:F TR

BOTTLE ASSY

Part #MC9S08DZ60ACLF | Microcontroller | DEX features: • 40-MHz HCS08 CPU (20-MHz bus) • HC08 instruction set with added BGND instruction • Support for up to 32 interrupt/reset sources • Flash read/program/erase over full operating voltage and temperature — MC9S08DZ60 = 60K — MC9S08DZ48 = 48K — MC9S08DZ32 = 32K — MC9S08DZ16 = 16K • Up to 2K EEPROM in-circuit programmable memory

Data rate: 14 Gb/s

Micron Technology DRAM SDRAM-DDR3L, Part #: MT40A4G4JC-062E:E TR | Dynamic random access memory | DEX capacitor MT40A256M16LY-062E:F TRMicron Technology DRAM SDRAM DDR4, Part #: MT40A4G4JC 062E: E TR features: VDD = VDDQ = 1. 2V + 60mv VPP = 2. 5V, 125mV, + 250mV On die, internal, adjustable VREFDQ generation 1. 2V pseudo open drain I O Refresh time of 8192 cycle at TC temperature range: 16 internal banks (x4, x8): 4 groups of 4 banks each 8n bit prefetch architecture Programmable data strobe preambles Data strobe preamble training Command Address latency (CAL) Multipurpose register